Hengfeng New Materials
衡封新材
Hengfeng New Materials
Materials/Deep Tech
Founded in 2018, Hengfeng New Materials is a domestic manufacturer of electronic-grade phenolic resins and specialty epoxy resins. Its core products are widely used in semiconductor packaging, copper-clad laminates, photoresists, and electronic adhesives.
Latest round: Series B Extension (2026)
Source: ChinaBulls — chinabulls.com
Last updated 2026-10-01
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