NCAP Co.,LTD.

华进半导体

NCAP Co.,LTD.

Advanced Manufacturing

Huajin Semiconductor develops advanced semiconductor packaging technologies. It conducts R&D on system-in-package and system integration technologies, including key 2.5D/3D TSV interconnect and integration processes such as TSV fabrication, bumping, backside TSV reveal, and chip stacking, and…

Latest round: Series B (2026)

Source: ChinaBulls — chinabulls.com

Last updated 2026-02-01