Xinai Technology

芯爱科技

Xinai Technology

Advanced Manufacturing

XinAi Technology manufactures advanced packaging substrates, focusing on the R&D and production of high-end products including coreless ETS, antenna-in-package (AiP), and flip-chip ball grid array (FCBGA) substrates. Its core products include ETS substrates for packaging applications requiring thin…

Latest round: Series B (2026)

Source: ChinaBulls — chinabulls.com

Last updated 2026-09-14