Xinhuilianxin Technology
芯慧联新
Xinhuilianxin Technology
Semiconductors/Chips
Xinhuilianxin (Suzhou) Technology Co., Ltd. develops wafer bonding equipment for 3D IC applications, including the manufacture of high-bandwidth memory (HBM) and 3D NAND flash memory.
Latest round: Angel (2025)
Source: ChinaBulls — chinabulls.com
Last updated 2025-02-01
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