Zhongde Technology

仲德科技

Zhongde Technology

Semiconductors/Chips

The rise of chiplet-based design and continued advances in packaging technologies such as SiP and 2.5D/3D packaging have increased total power within chip packages and created complex three-dimensional transient temperature fields, sharply raising the risk of chip damage from thermal stress.…

Latest round: Series A Extension (2026)

Source: ChinaBulls — chinabulls.com

Last updated 2026-04-01