China Wafer Level CSP Co.,Ltd.
晶方科技
China Wafer Level CSP Co.,Ltd.
Advanced Manufacturing
Founded in Suzhou in June 2005, China Wafer Level CSP Co., Ltd. (SSE: 603005) develops and innovates technologies to provide customers with reliable, miniaturized, high-performance, and cost-effective semiconductor packaging services at scale.
Latest round: Post-IPO (2022)
Source: ChinaBulls — chinabulls.com
Last updated 2022-06-01
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